Standard

NEK IEC 60749-15:2003

Feb 2003 Withdrawn

Note: This standard has a new edition: NEK IEC 60749-15:2020

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Language English

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Abstract

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Document information

Standard from NEK
Published: 7 February 2003
Withdrawn: 28 October 2010
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaced by: NEK IEC 60749-15:2010
Replaces: NEK IEC 60749:1996+A1:2000+A2:2001 CSV
Replaces: NEK IEC 60749-7:2002
Replaces: NEK IEC PAS 62174:2000
Replaces: NEK IEC 60749:1996
Adopted from: IEC 60749-15:2003

NEK IEC 60749-15:2003

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NEK IEC 60749-15:2020

NEK IEC 60749-15:2010