Standard

NEK IEC 60749-15:2010

Oct 2010 Withdrawn

Note: This standard has a new edition: NEK IEC 60749-15:2020

Corrigendums and amendments are bought separately.

Language English

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Abstract

IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.

Document information

Standard from NEK
Published: 28 October 2010
Withdrawn: 14 July 2020
Edition: 2.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaced by: NEK IEC 60749-15:2020
Replaces: NEK IEC 60749-15:2003
Adopted from: IEC 60749-15:2010

NEK IEC 60749-15:2010

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NEK IEC 60749-15:2020