Standard

NEK IEC PAS 62174:2000

Withdrawn

Corrigendums and amendments are bought separately.

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Abstract

Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Document information

  • Standard from NEK
  • Published:
  • Withdrawn:
  • Edition: 1.0
  • Version: 1
  • Document type: PAS
  • Pages
  • ICS 31.080.01
  • National Committee TC 47

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