Standard

IEC 60749-23:2004 ED1

Revised

Note: This standard has a new edition: IEC 60749-23:2025 ED2

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Abstract

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.

Document information

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 1
  • Version: 1
  • Document type: IS
  • ICS 31.080.01
  • ISO TC TC 47

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