Standard

IEC 60749-23:2025 ED2

Dec 2025 Published

Corrigendums and amendments are bought separately.

Language English English/French

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Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life Published IEC 60749-23:2025 RLV Redline Publication date: Dec 2025 Language: English Services: Read Online (No printing ), Printed and bound

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document. This edition includes the following significant technical changes with respect to the previous edition: a) absolute stress test definitions and resultant test durations have been updated.

Document information

Standard from IEC
Published: 9 December 2025
Edition: 2
Version: 1
Document type: IS
ISBN: 9782832709030

ICS 31.080.01
ISO TC TC 47

Product Relations

Revises: IEC 60749-23:2004+AMD1:2011 CSV
Revises: IEC 60749-23:2004 ED1
FRANKFURT AGREEMENT: FprEN IEC 60749-23:2025

IEC 60749-23:2025 ED2

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