Standard

IEC 60749-15:2003 ED1

Feb 2003 Revised

Note: This standard has a new edition: IEC 60749-15:2020 ED3

Corrigendums and amendments are bought separately.

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Abstract

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Document information

Standard from IEC
Published: 7 February 2003
Withdrawn: 28 October 2010
Edition: 1
Version: 1
Document type: IS
Pages
ISBN: 2831868386

ICS 31.080.01
ISO TC TC 47

Product Relations

Revised by: IEC 60749-15:2010 ED2
Replaces: IEC PAS 62174:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-15:2003 ED1

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IEC 60749-15:2020 ED3

IEC 60749-15:2010 ED2