Standard

IEC PAS 62174:2000 ED1

Aug 2000 Replaced

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Language English

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Abstract

Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Document information

Standard from IEC
Published: 22 August 2000
Withdrawn: 31 March 2003
Edition: 1
Version: 1
Document type: PAS
Pages
ISBN: 283185301X

ICS 31.080.01
ISO TC TC 47

Product Relations

Replaced by: IEC 60749-15:2003 ED1

IEC PAS 62174:2000 ED1

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Abstract

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Extended editions Extended editions (0)

Version history Related corrigendum and amendments (0)

Abstract

Document information

Product Relations

Product life cycle