Standard

IEC 60749-15:2010 ED2

Oct 2010 Revised

Note: This standard has a new edition: IEC 60749-15:2020 ED3

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Abstract

IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.

Document information

Standard from IEC
Published: 28 October 2010
Withdrawn: 14 July 2020
Edition: 2
Version: 1
Document type: IS
Pages
ISBN:

ICS 31.080.01
ISO TC TC 47

Product Relations

Revised by: IEC 60749-15:2020 RLV
Revised by: IEC 60749-15:2020 ED3
Revises: IEC 60749-15:2003 ED1

IEC 60749-15:2010 ED2

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IEC 60749-15:2020 ED3