Standard

IEC 61190-1-2:2007 ED2

Revidert

Merknad: Denne standarden har en ny utgave: IEC 61190-1-2:2014 ED3

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Omfang

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Dokumentinformasjon

  • Standard fra IEC
  • Publisert:
  • Tilbaketrukket:
  • Utgave: 2
  • Versjon: 1
  • Varetype: IS
  • ICS 31.190
  • ISO TC TC 91

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