Standard

IEC 61190-1-2:2007 ED2

Apr 2007 Revised

Note: This standard has a new edition: IEC 61190-1-2:2014 ED3

Corrigendums and amendments are bought separately.

Language English English/French

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Abstract

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Document information

Standard from IEC
Published: 26 April 2007
Withdrawn: 19 February 2014
Edition: 2
Version: 1
Document type: IS
ISBN: 2831891302

ICS 31.190
ISO TC TC 91

Product Relations

Revised by: IEC 61190-1-2:2014 ED3
Revises: IEC 61190-1-2:2002 ED1
Adopted by: NEK IEC 60249-2-2:1985

Product life cycle

Previous product

Revised

IEC 61190-1-2:2002 ED1
Current product

Revised

IEC 61190-1-2:2007 ED2
Stage 99.60
Revised by

Published

IEC 61190-1-2:2014 ED3

IEC 61190-1-2:2007 ED2

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IEC 61190-1-2:2014 ED3