Standard

NEK IEC 61191-3:2017

May 2017 Published

Note: This standard has a new edition: NEK IEC 61191-3:2017

Corrigendums and amendments are bought separately.

Language English

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Abstract

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Document information

Standard from NEK
Published: 30 May 2017
Edition: 2.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.240
National Committee NEK/NK91

Product Relations

Replaces: NEK IEC 61191-3:1998
Adopted from: IEC 61191-3:2017

NEK IEC 61191-3:2017

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