Standard

NEK IEC 61191-3:1998

Aug 1998 Withdrawn

Note: This standard has a new edition: NEK IEC 61191-3:2017

Corrigendums and amendments are bought separately.

Language English

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Abstract

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Document information

Standard from NEK
Published: 28 August 1998
Withdrawn: 30 May 2017
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.240
National Committee NEK/NK91

Product Relations

Replaced by: NEK IEC 61191-3:2017
Replaced by: NEK IEC 61191-3:2017
Adopted from: IEC TR 63040:2016 ED1

NEK IEC 61191-3:1998

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NEK IEC 61191-3:2017

NEK IEC 61191-3:2017