Standard

NEK IEC 61188-6-3:2024

Dec 2024 Published

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Language English

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Abstract

IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.This first edition partially cancels and replaces the IEC 61188-5 series of International Standards.The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.

Document information

Standard from NEK
Published: 9 December 2024
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.180
ICS 31.190
National Committee NEK/NK91

Product Relations

Replaces: NEK IEC 61188-5-3:2007
Replaces: NEK IEC 61188-5-8:2007
Replaces: NEK IEC 61188-5-5:2007
Replaces: NEK IEC 61188-5-4:2007
Replaces: NEK IEC 61188-5-2:2003
Replaces: NEK IEC 61188-5-6:2003
Adopted from: IEC 61188-6-3:2024

NEK IEC 61188-6-3:2024

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