Standard

NEK IEC 61188-5-2:2003

Jun 2003 Published

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Language English

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Abstract

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Document information

Standard from NEK
Published: 24 June 2003
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.180
ICS 31.190
National Committee NEK/NK91

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Replaced by: NEK IEC 61188-6-3:2024
Replaced by: NEK IEC 61188-6-2:2021
Adopted from: IEC 60679-3:2001 ED2
Adopted from: IEC 61188-5-2:2003

NEK IEC 61188-5-2:2003

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Abstract

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Abstract

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