Standard

NEK IEC 61188-5-6:2003

Jan 2003 Published

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Language English

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Abstract

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

Document information

Standard from NEK
Published: 23 January 2003
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.190
National Committee NEK/NK91

Product Relations

Replaced by: NEK IEC 61188-6-3:2024
Replaced by: NEK IEC 61188-6-2:2021
Adopted from: IEC 60679-5:1998 ED1
Adopted from: IEC 61188-5-6:2003

NEK IEC 61188-5-6:2003

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Abstract

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Abstract

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