Standard

NEK IEC 60749-20:2008

Dec 2008 Withdrawn

Note: This standard has a new edition: NEK IEC 60749-20:2020

Corrigendums and amendments are bought separately.

Language English

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Abstract

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows: - to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C; - reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1; - update for lead-free solder; - correct certain errors in the original Edition 1.

Document information

Standard from NEK
Published: 9 December 2008
Withdrawn: 31 August 2020
Edition: 2.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaced by: NEK IEC 60749-20:2020
Replaces: NEK IEC 60749-20:2002
Adopted from: IEC 60749-20:2008

NEK IEC 60749-20:2008

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NEK IEC 60749-20:2020