Standard

NEK IEC 60749-20:2002

Sep 2002 Withdrawn

Note: This standard has a new edition: NEK IEC 60749-20:2020

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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat Withdrawn NEK IEC 60749-20:2002/COR1:2003 Corrigendum from Publication date: Aug 2003 Version: 1 Language: English Services: Read Online (No printing ), Printed and bound

Abstract

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.

Document information

Standard from NEK
Published: 30 September 2002
Withdrawn: 9 December 2008
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaced by: NEK IEC 60749-20:2008
Replaces: NEK IEC 60749:1996+A1:2000+A2:2001 CSV
Replaces: NEK IEC 60749-7:2002
Replaces: NEK IEC 60749:1996
Adopted from: IEC 60749-20:2002

NEK IEC 60749-20:2002

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NEK IEC 60749-20:2020

NEK IEC 60749-20:2008