Standard

NEK IEC 60749-19:2003

Published

Note: This standard has a new edition: NEK IEC 60749-19:2003+A1:2010 CSV

Corrigendums and amendments are bought separately.

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Abstract

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.

Document information

  • Standard from NEK
  • Published:
  • Edition: 1.0
  • Version: 1
  • Document type: NAT
  • Pages
  • ICS 31.080.01
  • National Committee NEK/NK47

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