Standard

NEK IEC 60068-2-58:2004

Jul 2004 Withdrawn

Note: This standard has a new edition: NEK IEC 60068-2-58:2015+A1:2017 CSV

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Language English

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Abstract

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.

Document information

Standard from NEK
Published: 15 July 2004
Withdrawn: 27 March 2015
Edition: 3.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 19.040
ICS 31.190
National Committee NEK/NK91

Product Relations

Replaced by: NEK IEC 60068-2-58:2015
Replaces: NEK IEC 60068-2-58:1999
Adopted from: IEC 60068-2-58:2004

NEK IEC 60068-2-58:2004

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NEK IEC 60068-2-58:2015+A1:2017 CSV

NEK IEC 60068-2-58:2015+A1:2017 CSV

NEK IEC 60068-2-58:2015