Standard

NEK IEC 60068-2-58:1989

Aug 1989 Withdrawn

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Language English

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Abstract

Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.

Document information

Standard from NEK
Published: 15 August 1989
Withdrawn: 28 April 2004
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 19.040
ICS 31.190
National Committee NEK/NK91

Product Relations

Replaced by: NEK IEC 60068-2-58:1999
Adopted from: IEC 60068-2-58:1989 , 0

NEK IEC 60068-2-58:1989

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