Standard

NEK IEC 60068-2-58:1999

Jan 1999 Withdrawn

Note: This standard has a new edition: NEK IEC 60068-2-58:2015+A1:2017 CSV

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Language English

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Abstract

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

Document information

Standard from NEK
Published: 15 January 1999
Withdrawn: 15 July 2004
Edition: 2.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 19.040
ICS 31.190
National Committee NEK/NK91

Product Relations

Replaced by: NEK IEC 60068-2-58:2004
Replaced by: NEK IEC 60068-2-58:2004
Replaces: NEK IEC 60068-2-58:1989

NEK IEC 60068-2-58:1999

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NEK IEC 60068-2-58:2015+A1:2017 CSV

NEK IEC 60068-2-58:2015+A1:2017 CSV

NEK IEC 60068-2-58:2015

NEK IEC 60068-2-58:2004

NEK IEC 60068-2-58:2004