Standard

IEC 61191-3:1998 ED1

Aug 1998 Revised

Note: This standard has a new edition: IEC 61191-3:2017 ED2

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Language English/French

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Abstract

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Document information

Standard from IEC
Published: 28 August 1998
Withdrawn: 30 May 2017
Edition: 1
Version: 1
Document type: IS
ISBN: 2831844606

ICS 31.240
ISO TC TC 91

Product Relations

Revised by: IEC 61191-3:2017 ED2
Adopted by: NEK IEC 62705:2014

Product life cycle

Current product

Revised

IEC 61191-3:1998 ED1
Stage 99.60
Revised by

Published

IEC 61191-3:2017 ED2

IEC 61191-3:1998 ED1

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IEC 61191-3:2017 ED2