Standard

IEC 61191-3:2017 ED2

May 2017 Published

Corrigendums and amendments are bought separately.

Language English English/French

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Abstract

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Document information

Standard from IEC
Published: 30 May 2017
Edition: 2
Version: 1
Document type: IS
ISBN: 9782832243978

ICS 31.240
ISO TC TC 91

Product Relations

Adopted by: NEK IEC PAS 62085:1998
Revises: IEC 61191-3:1998 ED1
FRANKFURT AGREEMENT: prEN 61191-3:2016

Product life cycle

Previous product

Revised

IEC 61191-3:1998 ED1
Current product

Published

IEC 61191-3:2017 ED2
Stage 60.60

IEC 61191-3:2017 ED2

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