Standard

IEC 61190-1-2:2002 ED1

Mar 2002 Revised

Note: This standard has a new edition: IEC 61190-1-2:2014 ED3

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Language English/French

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Abstract

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Document information

Standard from IEC
Published: 22 March 2002
Withdrawn: 26 April 2007
Edition: 1
Version: 1
Document type: IS
ISBN: 2831862345

ICS 31.190
ISO TC TC 91

Product Relations

Adopted by: NEK IEC TR 62699-1:2014
Revised by: IEC 61190-1-2:2007 ED2

Product life cycle

Current product

Revised

IEC 61190-1-2:2002 ED1
Stage 99.60
Revised by

Revised

IEC 61190-1-2:2007 ED2

IEC 61190-1-2:2002 ED1

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IEC 61190-1-2:2014 ED3

IEC 61190-1-2:2007 ED2