Standard

IEC 60749-32:2002 ED1

Aug 2002 Published

Note: This standard has a new edition: IEC 60749-32:2002+AMD1:2010 CSV

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Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) Published IEC 60749-32:2002/AMD1:2010 ED1 Amendment from Publication date: Jul 2010 Version: 1 Language: English, English/French Services: Read Online (No printing ), Printed and bound
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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) Published IEC 60749-32:2002/COR1:2003 ED1 Corrigendum from Publication date: Aug 2003 Version: 1 Language: English/French Services: Read Online (No printing ), Printed and bound

Abstract

Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.

Document information

Standard from IEC
Published: 30 August 2002
Edition: 1
Version: 1
Document type: IS
Pages
ISBN:

ICS 31.080.01
ISO TC TC 47

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Partially replaces: IEC 60749:1996 ED2

IEC 60749-32:2002 ED1

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IEC 60749-32:2002+AMD1:2010 CSV