Standard

IEC 60749-20:2020 ED3

Aug 2020 Published

Corrigendums and amendments are bought separately.

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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat Published IEC 60749-20:2020 RLV Redline Publication date: Aug 2020 Language: English Services: Read Online (No printing ), Printed and bound

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.

Document information

Standard from IEC
Published: 31 August 2020
Edition: 3
Version: 1
Document type: IS
Pages
ISBN:

ICS 31.080.01
ISO TC TC 47

Product Relations

Adopted by: NEK IEC 62928:2017
Revises: IEC 60749-20:2008 ED2
FRANKFURT AGREEMENT: FprEN IEC 60749-20:2020

IEC 60749-20:2020 ED3

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