Standard

IEC 60749-20:2002 ED1

Sep 2002 Revised

Note: This standard has a new edition: IEC 60749-20:2020 ED3

Preview External link

Corrigendums and amendments are bought separately.

Language English/French

Services Read Online (No printing ) kr 2 343,00 Printed and bound Delivery time: 5-10 days kr 2 929,00

There are no extended editions available for this standard

Open product
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat Revised IEC 60749-20:2002/COR1:2003 ED1 Corrigendum from Publication date: Aug 2003 Version: 1 Language: English/French Services: Read Online (No printing ), Printed and bound

Abstract

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.

Document information

Standard from IEC
Published: 30 September 2002
Withdrawn: 9 December 2008
Edition: 1
Version: 1
Document type: IS
Pages
ISBN: 2831865557

ICS 31.080.01
ISO TC TC 47

Product Relations

Revised by: IEC 60749-20:2008 ED2
Partially replaces: IEC 60749:1996 ED2
Adopted by: NEK IEC 60067E:1962

IEC 60749-20:2002 ED1

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

IEC 60749-20:2020 ED3

IEC 60749-20:2008 ED2