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NEK IEC PAS 62174:2000

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Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

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  • Varetype: PAS
  • Products.Specs.pages
  • ICS 31.080.01
  • National Committee TC 47

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