Standard

JEDEC JEP140

Revidert

Merknad: Denne standarden har en ny utgave: JEDEC JEP140

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Omfang

The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards. 

Dokumentinformasjon

  • Standard fra JEDEC_AC
  • Publisert:
  • Versjon: 0
  • Varetype: IS