Standard

JEDEC JEP140

Revised

Note: This standard has a new edition: JEDEC JEP140

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Abstract

The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards. 

Document information

  • Standard from JEDEC_AC
  • Published:
  • Version: 0
  • Document type: IS