Standard

NEK IEC 61190-1-2:2002

Mar 2002 Withdrawn

Note: This standard has a new edition: NEK IEC 61190-1-2:2014

Corrigendums and amendments are bought separately.

Language English

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Abstract

Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Document information

Standard from NEK
Published: 22 March 2002
Withdrawn: 26 April 2007
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.190
National Committee NEK/NK91

Product Relations

Adopted from: IEC 60034-30-1:2014 ED1
Replaced by: NEK IEC 61190-1-2:2007
Adopted from: IEC 61190-1-2:2002

NEK IEC 61190-1-2:2002

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NEK IEC 61190-1-2:2014

NEK IEC 61190-1-2:2007