Standard

NEK IEC 60749-9:2002

Apr 2002 Withdrawn

Note: This standard has a new edition: NEK IEC 60749-9:2017

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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking Withdrawn NEK IEC 60749-9:2002/COR1:2003 Corrigendum from Publication date: Aug 2003 Version: 1 Language: English Services: Read Online (No printing ), Printed and bound

Abstract

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.

Document information

Standard from NEK
Published: 12 April 2002
Withdrawn: 3 March 2017
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaced by: NEK IEC 60749-9:2017
Replaced by: NEK IEC 60749-9:2017
Replaces: NEK IEC 60749:1996+A1:2000+A2:2001 CSV
Replaces: NEK IEC 60749-7:2002
Replaces: NEK IEC PAS 62175:2000
Replaces: NEK IEC 60749:1996
Adopted from: IEC 60749-9:2002

NEK IEC 60749-9:2002

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NEK IEC 60749-9:2017

NEK IEC 60749-9:2017