Standard

NEK IEC 60749-3:2017

Mar 2017 Published

Note: This standard has a new edition: NEK IEC 60749-3:2017

Corrigendums and amendments are bought separately.

Language English

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Abstract

IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomenon of tin whiskers; c) inclusion of an optional report form/checklist.

Document information

Standard from NEK
Published: 3 March 2017
Edition: 2.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaces: NEK IEC 60749-3:2002
Adopted from: IEC 60749-3:2017

NEK IEC 60749-3:2017

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