Standard

NEK IEC 60749-3:2002

Apr 2002 Withdrawn

Note: This standard has a new edition: NEK IEC 60749-3:2017

Preview

Corrigendums and amendments are bought separately.

Language English

Services Read Online (No printing ) kr 171,00 Printed and bound Delivery time: 5-10 days kr 213,00

There are no extended editions available for this standard

Open product
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination Withdrawn NEK IEC 60749-3:2002/COR1:2003 Corrigendum from Publication date: Aug 2003 Version: 1 Language: English Services: Read Online (No printing ), Printed and bound

Abstract

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.

Document information

Standard from NEK
Published: 9 April 2002
Withdrawn: 3 March 2017
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaced by: NEK IEC 60749-3:2017
Replaced by: NEK IEC 60749-3:2017
Replaces: NEK IEC 60749:1996+A1:2000+A2:2001 CSV
Replaces: NEK IEC 60749-7:2002
Replaces: NEK IEC PAS 62163:2000
Replaces: NEK IEC 60749:1996
Adopted from: IEC 60749-3:2002

NEK IEC 60749-3:2002

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

NEK IEC 60749-3:2017

NEK IEC 60749-3:2017