Standard

NEK IEC 60749-25:2003

Jul 2003 Published

Corrigendums and amendments are bought separately.

Language English

Services Read Online (No printing ) kr 1 295,00 Printed and bound Delivery time: 5-10 days kr 1 618,00

There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Document information

Standard from NEK
Published: 11 July 2003
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaces: NEK IEC 60749:1996+A1:2000+A2:2001 CSV
Replaces: NEK IEC 60749-7:2002
Replaces: NEK IEC PAS 62178:2000
Replaces: NEK IEC 60749:1996
Adopted from: IEC 60749-25:2003

NEK IEC 60749-25:2003

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer