Standard

NEK IEC 60749-22:2002

Sep 2002 Published

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Language English

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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength Published NEK IEC 60749-22:2002/COR1:2003 Corrigendum from Publication date: Aug 2003 Version: 1 Language: English Services: Read Online (No printing ), Printed and bound

Abstract

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.

Document information

Standard from NEK
Published: 12 September 2002
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaces: NEK IEC 60749:1996+A1:2000+A2:2001 CSV
Replaces: NEK IEC 60749-7:2002
Replaces: NEK IEC 60749:1996
Adopted from: IEC 60749-22:2002

NEK IEC 60749-22:2002

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