Standard

IEC TS 62396-5:2008 ED1

Aug 2008 Replaced

Corrigendums and amendments are bought separately.

Language English

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There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

IEC TS 62396-5:2008 (E) provides a more precise definition of the threat that thermal neutrons pose to avionics as a second mechanism for inducing single event upset (SEU) in microelectronics. Addresses more in detail the following: detailed evaluation of the existing literature on measurements of the thermal flux inside of airliners; an enhanced compilation of the thermal neutron SEU cross section in currently available SRAM devices (more than 20 different devices).

Document information

Standard from IEC
Published: 19 August 2008
Withdrawn: 22 August 2014
Edition: 1
Version: 1
Document type: TS
ISBN: 2831899591

ICS 03.100.50
ICS 31.020
ICS 49.060
ISO TC TC 107

Product Relations

Replaced by: IEC 62396-5:2014 ED1
Replaces: IEC PAS 62396-5:2007 ED1

Product life cycle

Previous product

Replaced

IEC PAS 62396-5:2007 ED1
Current product

Replaced

IEC TS 62396-5:2008 ED1
Stage 99.60
Replaced by

Published

IEC 62396-5:2014 ED1

IEC TS 62396-5:2008 ED1

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