Standard

IEC PAS 62307:2002 ED1

Mar 2002 Replaced

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Language English

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Abstract

Details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.

Document information

Standard from IEC
Published: 12 March 2002
Withdrawn: 24 July 2006
Edition: 1
Version: 1
Document type: PAS
Pages
ISBN: 2831862469

ICS 31.200
ISO TC TC 47

Product Relations

Replaced by: IEC 60749-39:2006 ED1

IEC PAS 62307:2002 ED1

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Abstract

Document information

Product Relations

Product life cycle

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Benefits of our business solution:

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Extended editions Extended editions (0)

Version history Related corrigendum and amendments (0)

Abstract

Document information

Product Relations

Product life cycle