Standard

IEC 60749-39:2006 ED1

Jul 2006 Revised

Note: This standard has a new edition: IEC 60749-39:2021 ED2

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Abstract

Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.

Document information

Standard from IEC
Published: 24 July 2006
Withdrawn: 29 November 2021
Edition: 1
Version: 1
Document type: IS
Pages
ISBN:

ICS 31.080.01
ISO TC TC 47

Product Relations

Revised by: IEC 60749-39:2021 RLV
Revised by: IEC 60749-39:2021 ED2
Replaces: IEC PAS 62307:2002 ED1

IEC 60749-39:2006 ED1

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IEC 60749-39:2021 ED2