Standard

IEC 61191-2:2017 ED3

May 2017 Published

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Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies Published IEC 61191-2:2017/COR1:2019 ED3 Corrigendum from Publication date: Sep 2019 Version: 1 Language: English Services: Read Online (No printing ), Printed and bound

Abstract

IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; b) some of the terminology used in the document has been updated; c) references to IEC standards have been corrected; d) five termination styles have been added. The contents of the corrigendum of September 2019 have been included in this copy.

Document information

Standard from IEC
Published: 23 May 2017
Edition: 3
Version: 1
Document type: IS
Pages
ISBN: 9782832243220

ICS 31.190
ICS 31.240
ISO TC TC 91

Product Relations

Revises: IEC 61191-2:2013 ED2
Adopted by: NEK IEC 60335-2-97:1998
FRANKFURT AGREEMENT: prEN 61191-2:2016

IEC 61191-2:2017 ED3

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