Standard

IEC 61191-2:2013 ED2

Jun 2013 Revised

Note: This standard has a new edition: IEC 61191-2:2017 ED3

Corrigendums and amendments are bought separately.

Language English/French

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Abstract

IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: - IPC-A-610 on workmanship has been included as a normative reference; - some of the terminology used in the document has been updated; - references to IEC standards have been corrected; - the use of lead-free solder paste and plating are addressed.

Document information

Standard from IEC
Published: 5 June 2013
Withdrawn: 23 May 2017
Edition: 2
Version: 1
Document type: IS
Pages
ISBN: 9782832208564

ICS 31.190
ICS 31.240
ISO TC TC 91

Product Relations

Revised by: IEC 61191-2:2017 ED3
Revises: IEC 61191-2:1998 ED1
FRANKFURT AGREEMENT: FprEN 61191-2:2013

IEC 61191-2:2013 ED2

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IEC 61191-2:2017 ED3