Standard

IEC 60749-9:2002 ED1

Apr 2002 Revised

Note: This standard has a new edition: IEC 60749-9:2017 ED2

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Language English/French

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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking Revised IEC 60749-9:2002/COR1:2003 ED1 Corrigendum from Publication date: Aug 2003 Version: 1 Language: English/French Services: Read Online (No printing ), Printed and bound

Abstract

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.

Document information

Standard from IEC
Published: 12 April 2002
Withdrawn: 3 March 2017
Edition: 1
Version: 1
Document type: IS
Pages
ISBN: 2831862876

ICS 31.080.01
ISO TC TC 47

Product Relations

Revised by: IEC 60749-9:2017 ED2
Replaces: IEC PAS 62175:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-9:2002 ED1

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IEC 60749-9:2017 ED2