Standard

IEC 60749-3:2002 ED1

Apr 2002 Revised

Note: This standard has a new edition: IEC 60749-3:2017 ED2

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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination Revised IEC 60749-3:2002/COR1:2003 ED1 Corrigendum from Publication date: Aug 2003 Version: 1 Language: English/French Services: Read Online (No printing ), Printed and bound

Abstract

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.

Document information

Standard from IEC
Published: 9 April 2002
Withdrawn: 3 March 2017
Edition: 1
Version: 1
Document type: IS
Pages
ISBN: 2831862752

ICS 31.080.01
ISO TC TC 47

Product Relations

Revised by: IEC 60749-3:2017 ED2
Replaces: IEC PAS 62163:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-3:2002 ED1

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IEC 60749-3:2017 ED2