Standard

IEC 60749-14:2003 ED1

Aug 2003 Published

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Abstract

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Document information

Standard from IEC
Published: 7 August 2003
Edition: 1
Version: 1
Document type: IS
Pages
ISBN:

ICS 31.080.01
ISO TC TC 47

Product Relations

Replaces: IEC PAS 62184:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-14:2003 ED1

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