Standard

IEC 60191-5:1997 ED2

Apr 1997 Published

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Abstract

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

Document information

Standard from IEC
Published: 23 April 1997
Edition: 2
Version: 1
Document type: IS
Pages
ISBN:

ICS 31.080.01
ISO TC TC 47/SC 47D

Product Relations

Adopted by: NEK IEC 60335-2-7:2008
Revises: IEC 60191-5:1987 ED1
Adopted by: NEK IEC TR 60355:1971

IEC 60191-5:1997 ED2

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