Standard

IEC 60191-5:1987 ED1

Sep 1987 Revised

Note: This standard has a new edition: IEC 60191-5:1997 ED2

Corrigendums and amendments are bought separately.

Language English/French

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Abstract

Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead bonding (OLB), etc., correspond to the state of the market at the date of edition of this standard. More especially, tape width and perforation dimensions have been derived from motion picture film standards. Progress in integrated circuit (IC) technology resulting in a higher number of terminals and user requirements may lead in the future to additional or new dimensions.

Document information

Standard from IEC
Published: 15 September 1987
Withdrawn: 23 April 1997
Edition: 1
Version: 1
Document type: IS
Pages
ISBN: 2831813514

ICS 31.080.01
ISO TC TC 47/SC 47D

Product Relations

Revised by: IEC 60191-5:1997 ED2
Adopted by: NEK IEC 60354:1972

IEC 60191-5:1987 ED1

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IEC 60191-5:1997 ED2