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NEK IEC TR 61760-5-1:2024

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Omfang

IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

Dokumentinformasjon

  • Standard fra NEK
  • Publisert:
  • Utgave: 1.0
  • Versjon: 1
  • Varetype: TR
  • ICS 31.190
  • National Committee NEK/NK91

Produktrelasjon

  • Adoptert fra: IEC TR 61760-5-1:2024