Standard

NEK IEC TR 61760-5-1:2024

Published

Corrigenda and amendments are bought separately.

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Abstract

IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

Document information

  • Standard from NEK
  • Published:
  • Edition: 1.0
  • Version: 1
  • Document type: TR
  • ICS 31.190
  • National Committee NEK/NK91

Product Relations

  • Adopted from: IEC TR 61760-5-1:2024