Standard

NEK IEC TR 60286-7:2019

Publisert

Rettelser og tillegg kjøpes separat.

Språk
Tjenester

Omfang

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Dokumentinformasjon

  • Standard fra NEK
  • Publisert:
  • Utgave: 1.0
  • Versjon: 1
  • Varetype: TR
  • ICS 31.020
  • ICS 31.240
  • National Committee NEK/NK40

Produktrelasjon

  • Adoptert fra: IEC TR 60286-7:2019