Standard

NEK IEC TR 60286-7:2019

Published

Corrigenda and amendments are bought separately.

Language
Services

Abstract

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Document information

  • Standard from NEK
  • Published:
  • Edition: 1.0
  • Version: 1
  • Document type: TR
  • ICS 31.020
  • ICS 31.240
  • National Committee NEK/NK40

Product Relations

  • Adopted from: IEC TR 60286-7:2019